Electronic Insulation Materials
A vacuum lamination press for controlled degassing, curing, and high-flatness bonding of copper foil and prepreg in CCL production.
Equipment and process details
Final parameters and system boundaries are confirmed against materials, process targets, capacity and site conditions.
Nantong Tongbo manufactures vacuum lamination press for PCB substrates. The vacuum laminating press is the core pressing equipment for copper clad laminate (CCL) production. It uses heating, vacuum, and constant pressure control to achieve stable curing and high-flatness bonding of copper foil and prepreg. During pressing, the system first removes moisture, volatiles, and low-molecular residues under vacuum, reducing resin flow resistance and internal stress, thereby preventing bubbles, interlayer voids, warpage, and surface unevenness.
Compared with traditional hot pressing, the vacuum laminating press significantly reduces pressing pressure — for FR-4, pressure can be lowered from 4.5–6 MPa to 2–3 MPa — while enhancing copper adhesion, dielectric reliability, and board flatness. The equipment is suitable for epoxy glass fiber (FR-4) and phenolic paper-based copper clad laminates, particularly for systems with high volatile content requiring degassing and controlled curing. It ensures improved mechanical, electrical, and drilling performance, making it an ideal solution for high-end PCB substrate lamination.
Configuration
Hot Press2； Cold Press1； Storage and Unloading Machines2； Mobile Loading/Unloading Machine1
Parameter | Specification |
|---|---|
Total Pressure | 10,000 kN |
Unit Pressure | 60 kg/㎡ |
Heating Plate Size | 1220 × 1372 mm (effective area: ≥1160 × 1310 mm) |
Number of Openings | 24 |
Number of Heating Plates | 27 (top and bottom plates: 2) |
Heating Method | Thermal oil |
Closing Speed (adjustable) | 600 mm/min |
Opening Speed (adjustable) | 200–800 mm/min |
Maximum Vacuum | ≤ -730 mmHg |
Vacuum Pumping Time | ≤ 2 min to -650 mmHg |
Parameter | Specification |
|---|---|
Total Pressure | 3,000 kN |
Heating Plate Size | 1220 × 1372 mm |
Number of Openings | 24 |
Cold Plate Thickness | 45 mm |
Closing Speed (adjustable) | 600 mm/min |
Opening Speed (adjustable) | 200–800 mm/min |
Cooling Rate | 4℃/min (60℃–180℃) |
Cooling Medium | Circulating water |
Parameter | Specification |
|---|---|
Layer Load Capacity | ≥800 kg |
In/Out Feeding Speed (VFD) | 2.0 m/min |
Travel Speed (VFD) | 3.8 m/min |
Parameter | Specification |
|---|---|
Layer Load Capacity | ≥800 kg |
Lifting / Lowering Speed (VFD) | 3.5 m/min |
Tip: The above parameters are for reference only. Actual number of openings, heating plate size, pressure, speed, and heating method can be adjusted according to your requirements.
Procurement guide
The published purpose is controlled degassing, curing, and flat bonding of copper foil and prepreg during CCL production, with hot pressing, cold pressing, and material handling configured together.
Confirm laminate format and build-up, opening count, required pressure and temperature cycle, vacuum target, output, utilities, plant layout, and loading and unloading scope.
Unit pressure, vacuum sign convention and reference pressure, evacuation time, and the stated cooling-rate temperature direction should be checked and tied to clear units and conditions.
Use an agreed material build-up and compare voids, flatness, bonding, electrical results, and cycle records under a documented trial method rather than treating a general process statement as a guarantee.
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